Please use this identifier to cite or link to this item: http://hdl.handle.net/20.500.12188/15551
Title: Reduction of Interface States Stress Generation by Oxygen Annealing of ALD Nanolaminated HfO2/Al2O3 Dielectric Stacks for Charge Trapping Devices
Authors: Skeparovski, A.
Novkovski, N.
Paskaleva, A.
Spassov, D.
Issue Date: 12-Sep-2021
Publisher: IEEE
Conference: 2021 IEEE 32nd International Conference on Microelectronics (MIEL)
URI: http://hdl.handle.net/20.500.12188/15551
DOI: 10.1109/miel52794.2021.9569062
Appears in Collections:Faculty of Natural Sciences and Mathematics: Conference papers

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