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dc.contributor.authorSkeparovski, A.en_US
dc.contributor.authorNovkovski, N.en_US
dc.contributor.authorPaskaleva, A.en_US
dc.contributor.authorSpassov, D.en_US
dc.date.accessioned2021-11-30T22:40:07Z-
dc.date.available2021-11-30T22:40:07Z-
dc.date.issued2021-09-12-
dc.identifier.urihttp://hdl.handle.net/20.500.12188/15551-
dc.language.isoenen_US
dc.publisherIEEEen_US
dc.titleReduction of Interface States Stress Generation by Oxygen Annealing of ALD Nanolaminated HfO2/Al2O3 Dielectric Stacks for Charge Trapping Devicesen_US
dc.typeProceeding articleen_US
dc.relation.conference2021 IEEE 32nd International Conference on Microelectronics (MIEL)en_US
dc.identifier.doi10.1109/miel52794.2021.9569062-
dc.identifier.urlhttp://xplorestaging.ieee.org/ielx7/9569024/9569026/09569062.pdf?arnumber=9569062-
item.grantfulltextnone-
item.fulltextNo Fulltext-
Appears in Collections:Faculty of Natural Sciences and Mathematics: Conference papers
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